The EKINOPS 360 is a dynamic, multi-reach optical transport system providing advanced networking capabilities for access, metro, regional and long haul applications based on its unique programmable hardware that delivers today’s solutions using tomorrow’s technology”.
At the heart of the EKINOPS 360 lies the T-Chip (Transport on-a-Chip Technology) that enables fast, flexible, and cost-effective service delivery. The T-Chip provides a programmable infrastructure capable of supporting any application type - both existing and future - from a common platform to speed the development and lower the cost of the EKINOPS transport solutions. Having all capabilities on a single chip provides cost and manufacturing efficiencies which in turn provide for fast and cost-effective service delivery. The 360 platform also supports EKINOPS patented DynaFEC technology that delivers superior Forward Error Correction for greater reach even over older fiber.
The EKINOPS 360 platform delivers rates from 100Mbps to 200G today and can scale to 400G and beyond. The T-Chip is produced exclusively by EKINOPS and is not dependent on component manufacturers for new transport capability on the 360 system. This means EKINOPS can deliver functionality ahead of the market providing our customers a distinct and sustainable competitive advantage. The EKINOPS 360 also offers a wide range of optical layer solutions from amplifiers to a truly scalable ROADM. These solutions allow our customers to minimize their upfront costs and grow their networks in a profitable manner.
The EKINOPS 360 platform is a NEBS Level 3 certified and ETSI compliant rack mountable transport system that spans metro, regional, and long haul applications. It supports a wide variety of data protocols and rates with channel plan options scaling to over 16 Tbps. In addition, the EKINOPS 360 platform offers a single fiber option that supports up to 640 bi-directional 10 Gbps channels or 32 bi-directional 200G channels today with larger channel options planned for the future. The 360 platform consists of a modular 7RU chassis for high density applications, a modular compact 2RU chassis for low-density applications, as well as 100G transponder and muxponder White Box shelves in 1RU form factor. With its unique combination of programmability, service density and configurability, the 360 platform offers unprecedented levels of flexibility to meet any network challenge.
The platform includes optical multiplexers (Mux/Demux), reconfigurable optical add/drop multiplexers (ROADM) and optical amplifiers (OA). Mux/Demux filter modules are designed in a modular fashion to accommodate channel growth without service interruption.
EKINOPS (Euronext Paris - FR0011466069 – EKI), a leading supplier of telecommunications solutions for telecom operators and businesses, announces the appointment of Vincent Munière as its new Chief Technology Officer and Vice President of Research and Development (CTO and VP of R&D). He will strengthen the EKINOPS technology vision, accelerate software innovation and lead the Group’s engineering and support team.
EKINOPS (Euronext Paris - FR0011466069 – EKI), a leading provider of open, future-proof and flexible solutions for the access network, today announces the completion of a partnership agreement covering North America and Mexico between EKINOPS and Lanner Electronics, the global leader in Whitebox Solutions™ for SD-WAN, uCPE, vCPE, and MEC platforms.
EKINOPS (Euronext Paris - FR0011466069 – EKI), a leading supplier of telecommunications solutions for telecom operators and businesses, has published its first half 2020 financial statements (for the period ended June 30, 2020) as approved by the Board of Directors on July 27, 2020. The statutory auditors have conducted a limited review of the first half financial statements and will shortly issue the corresponding report.