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EKINOPS Introduces Cost-Effective 40G Wave Bonding Technology, Changing the Dynamics of the High-Speed Transmission Market

EKINOPS Introduces Cost-Effective 40G Wave Bonding Technology, Changing the Dynamics of the High-Speed Transmission Market

EKINOPS today announced that it will introduce the industry’s first truly cost-effective 40G transport in early 2009 for its flagship EKINOPS 360 platform;

EKINOPS is a leading provider of next generation dynamic multi-reach long-haul, regional, and metro transport aggregation solutions for service providers, MSOs, and enterprise networks. Using its patent pending Wave Bonding technology, EKINOPS is delivering 40G (gigabit per second) transmission with the ability to transport both native 40G and 4x10G payloads.

The first application of the Wave Bonding technology will target higher channel counts at 10G using a 4x10G Muxponder to multiplex four 10G payloads onto a 40G wavelength. Wave Bonding will allow EKINOPS to achieve up to 320 channels, all in the C-Band spectrum, at 10G.

“The problem with 40G is that it hasn’t been cost-effective until now,” said Rob Adams, vice president of global marketing for Ekinops. “40G transmission systems have been much more costly than the comparable equipment to deliver four 10G channels, and haven’t offered the same performance. So there has been no real benefit in making the move to 40G. EKINOPS has solved both those problems with our Wave Bonding technology.”

Other 40G systems don’t transmit as far as 10G systems, requiring customers who want to move up from 10G to 40G over longer links to disrupt their network routes and install regeneration equipment. Ekinops’ Wave Bonding technology enables delivery of 40G with essentially the same performance characteristics as its 10G transmission. That includes the ability to reach hundreds of kilometers with no in-line amplification and a total distance of 2,000 kilometers with full channel counts on the EKINOPS 360 transport system.

“Achieving 40G transmission cost-effectively has been one of the challenges of enabling widespread usage of the technology,” observed Jason Marcheck, Principal Analyst, Optical Infrastructure, at Current Analysis. “By pointing to breakthroughs designed to deliver 40G wavelengths at a cost point below the equivalent cost of four independent 10G wavelengths, Ekinops’ Wave Bonding technology has the potential to change the dynamics of the 40G market and make 40G transport a viable option for more network operators.”

In addition to the use of Wave Bonding, EKINOPS will take advantage of its recently announced DynaFEC technology to enable 40G to achieve a reach similar to 10G. DynaFEC is the highest-gain forward error correction technology on the market, allowing for cost-effective transport by providing gain through software rather than more expensive hardware components.

“It now makes economic sense to move to 40G,” said Didier Bredy, CEO of Ekinops. “Because we have brought economy to 40G transport using our Wave Bonding technology, 40G line rates can be used to more cost-effectively transport 10G traffic in the short term and then for native 40G applications in the future, as those applications become more abundant in the market.”

A key to Ekinops’ ability to hold down the cost of its 40G solution is the company’s unique T-Chip (Transport on a Chip). The T-Chip can be programmed for virtually any functionality. It is a dynamic, firmware programmable, field upgradable chip that not only allows EKINOPS to design, manufacture, and deliver equipment to customers more quickly and at a lower cost, but also reduces power requirements.

”One of the other benefits of the Wave Bonding technology is our ability to transport 40G and 10G directly adjacent to each other on the same system,” Adams noted. ”This is unlike other 40G solutions that disrupt adjacent 10G channels and require the use of guard bands (empty space between the two technologies). With Wave Bonding, we are able to provide a smooth and bandwidth-efficient migration to 40G for our customers.”

The initial offering in early 2009 features a 4x10G muxponder, enabling 160 channels of 10G transmission. Later in 2009, EKINOPS will deliver a 40G serial interface, and at that point be able to offer 320 channels of 10G, or 80 channels of 40G, all in the C-Band spectrum.

  • Customer Link (Website): http://
  • About Ekinops: About EKINOPS
  • EKINOPS Boilerplate:

    EKINOPS is a leading designer and supplier of next generation optical transport equipment for service providers and enterprise customers. The EKINOPS 360 Dynamic, Multi-Reach Transport System provides DWDM and CWDM on a single platform that addresses Metro, Regional, and Long Haul applications.

    The EKINOPS 360 system relies on the innovative, programmable EKINOPS T-Chip (TRANSPORT ON-A-CHIP TECHNOLOGY) that enables Fast, Flexible, and Cost-effective service delivery for building high speed optical networks. Using the EKINOPS 360 carrier-grade system, operators can increase transport capacity of their networks – CWDM, DWDM, Ethernet, ESCON, Fiber Channel, SONET/SDH, and uncompressed video (HD-SDI, SD-SDI, ASI) – through the industry’s most efficient aggregation of services.

    The company is headquartered in Lannion, France, with offices in Europe, the USA and Asia.

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